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Addplate™ and NiPLATE™ 700 A COMPOSITE SILICON CARBIDE, MEDIUM PHOSPHOROUS,
ELECTROLESS NICKEL PLATING PROCESS The 700 system is a composite silicon carbide, electroless nickel process designed to deposit a uniform composite with ultra-fine silicon carbide particles onto a great variety of metals, alloys, and non-conductors. The 700 system is available in two packaging options to best meet your needs. The NiPLATE™ option provides the greatest convenience to the user, while the ADDPLATE™ option provides the greatest economy for shipping and use. Both options produce the same properties and quality.
Some advantages of the 700 system are:
The 700 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C. Typical Deposit Properties (for EN alloy devoid of particles):
Preferred Operating Conditions:
Composite electroless nickel systems are covered under one or more of Surface Technology, Inc.'s US Patents numbered 4,997,686, 5,145,517, 5,300,330, 5,863,616, and others depending on materials and use. CLICK HERE for additional information on the NiPLATE™ 700 Coating Consult a Surface Technology, Inc. Sales or Technical Service Representative for further information about this or any of our products and services.
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