NiSLIP™ 500

The NiSLIP 500 composite PTFE - electroless nickel system is available in five systems. NiSLIP 510 uses a medium phosphorous alloy suitable for most applications, and NiSLIP 520 uses a high phosphorous alloy for applications requiring even greater corrosion resistance. A lead and cadmium free version of each of these systems is also available: NiSLIP 511 for medium phosphorous, and NiSLIP 521 for high phosphprous. All four systems utilize Surface Technology, Inc.'s patented NiSLIP 500 D PTFE Dispersion. The NiSLIP 515 system is notable for its revolutionary plating rate of two to three times conventional EN-PTFE plating baths.  It is medium phosphorous and free of lead and cadmium.

NiSLIP™ 510

A COMPOSITE PTFE, MEDIUM PHOSPHOROUS, ELECTROLESS NICKEL PLATING PROCESS

The 510 system is a composite PTFE, mid-phosphorous, electroless nickel process designed to deposit a uniform composite with ultra-fine PTFE particles onto a great variety of metals, alloys, and non-conductors.

The 510 system is available in two packaging options to best meet your needs. The NiPLATE option provides the greatest convenience to the user, while the ADDPLATE option provides the greatest economy for shipping and use. Both options produce the same properties and quality.

  • The NiSLIP 510 option is supplied in four liquid concentrates: NiSLIP 510 A, 510 B, and 500 D are used for make-up, and NiSLIP 510 A, 510 C, and 500 D are used for replenishment.
  • The ADDPLATE 510 option is supplied in three liquid concentrates: ADDPLATE 510 M is used for bath make up with NiSLIP 500 D and standard nickel sulfate and sodium hypophosphite commodities, and ADDPLATE 510 R is used for replenishment of the bath with NiSLIP 500 D and the same standard nickel sulfate and sodium hypophosphite commodities.

Some advantages of the 510 system are deposits with low coefficient of friction, self-lubricity, and excellent release properties; as well as corrosion resistance comparable to conventional electroless nickel.

The 510 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C.

Typical Deposit Properties:

Coefficient of Static Friction 0.1
Coefficient of Dynamic Friction 0.08-0.10
PTFE Content 20-26%
Phosphorus Content 7-9% by wt.
Hardness:  
o as plated 300 VHN100
o heat treated @ 400°C for 1 hr. 550 VHN100
Salt Spray (ASTM-B-117) 100 hrs.
Stress almost none
Magnetic Properties slightly magnetic
Deposition rate 0.25-0.35 mil per hour

Preferred Operating Conditions:

  Range Optimum
Solution Temperature 88°- 92 °C (190°-198°F) 90°C(194°F)
Solution pH 4.6 - 5.0 4.8
Bath Loading 0.3 - 0.8 ft2/gal 0.5 ft2/gal
Nickel Metal Concentration 0.65 - 0.85 oz/gal 0.8 oz/gal
H2PO2 Concentration 3.5 - 4.5 oz/gal 4.0 oz/gal
Agitation Light Mechanical  

NiSLIP™ 515

A HIGH SPEED, COMPOSITE PTFE, MEDIUM PHOSPHOROUS, ELECTROLESS NICKEL PLATING PROCESS

The 515 system is a composite PTFE, mid-phosphorous, electroless nickel process designed to deposit a uniform composite with ultra-fine PTFE at an exceptionally high plating rate.

The 515 system features numerous important advantages for the plater:

  • Plating rate about 20 microns per hour  (dramatically higher than the conventional 7.5 microns per hour) 
  • Reduced processing time, labor and energy costs  
  • Increases productivity and  the opportunity for thicker EN-PTFE deposits  
  • Capable of operating at 70 degrees C and therefore capable of plating EN-PTFE on plastic at a rate of about 7.5 microns per hour.  
  • More than three metal turnovers achieved in STI plating tanks  
  • Consistent color throughout the bath's life   
  • Standard  20 - 25% PTFE content, with potential for higher 
  • Bath is more tolerant to agitation than standard EN-PTFE    
  • Waste treatment can be done according to standard methods.    
  • No lead and no cadmium    
  • Available with no PFOS    
  • Patent pending

The 515 system is available in two packaging options to best meet your needs. The NiPLATE option provides the greatest convenience to the user, while the ADDPLATE option provides the greatest economy for shipping and use. Both options produce the same properties and quality.

  • The NiSLIP 515 option is supplied in four liquid concentrates: NiSLIP 515 A, 515 B, and 515 D are used for make-up, and NiSLIP 515 A, 515 C, and 515 D are used for replenishment.
  • The ADDPLATE 515 option is supplied in three liquid concentrates: ADDPLATE 515 M is used for bath make up with NiSLIP 515 D and standard nickel sulfate and sodium hypophosphite commodities, and ADDPLATE 515 R is used for replenishment of the bath with NiSLIP 515 D and the same standard nickel sulfate and sodium hypophosphite commodities.

Some advantages of the 515 system are deposits with low coefficient of friction, self-lubricity, and excellent release properties; as well as corrosion resistance comparable to conventional electroless nickel.

The 515 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C.

Typical Deposit Properties:

Coefficient of Static Friction 0.1
Coefficient of Dynamic Friction 0.08-0.10
PTFE Content 20-25%
Phosphorus Content 7-9% by wt.
Hardness  
o as plated 350 VHN100
o heat treated @ 400°C for 1 hr. 450-500 VHN100
Salt Spray (ASTM-B-117) 100 hrs.
Stress almost none
Magnetic Properties slightly magnetic
Deposition rate 0.7-0.9 mil per hour

Preferred Operating Conditions:

 

Range

Optimum

Solution Temperature

85°- 92 °C (185°-198°F)

90°C(194°F)

Solution pH

5.8 – 6.3

6.1

Bath Loading

0.3 - 0.7 ft2/gal

0.5 ft2/gal

Nickel Metal Concentration

0.65 – 0.85 oz/gal

0.8 oz/gal

H2PO2 Concentration

3.5 - 4.5 oz/gal

4.0 oz/gal

Agitation

Light Mechanical

 

NiSLIP™ 520

A COMPOSITE PTFE, HIGH PHOSPHOROUS, ELECTROLESS NICKEL PLATING PROCESS

The 520 system is a composite PTFE, high phosphorous, electroless nickel process designed to deposit a uniform composite with ultra-fine PTFE particles onto a great variety of metals, alloys, and non-conductors.

The 520 system is available in two packaging options to best meet your needs. The NiPLATE option provides the greatest convenience to the user, while the ADDPLATE option provides the greatest economy for shipping and use. Both options produce the same properties and quality.

  • The NiSLIP 520 option is supplied in four liquid concentrates: NiSLIP 520 A, 520 B, and 500 D are used for make-up, and NiSLIP 520 A, 520 C, and NiSLIP 500 D are used for replenishment.
  • The ADDPLATE 520 option is supplied in three liquid concentrates: ADDPLATE 520 M is used for bath make up with NiSLIP 500 D and standard nickel sulfate and sodium hypophosphite commodities, and ADDPLATE 520 R is used for replenishment of the bath with NiSLIP 500 D and the same standard nickel sulfate and sodium hypophosphite commodities.

Some advantages of the 520 system are deposits with low friction, self-lubricity, and release properties; as well as increased corrosion resistance.

The 520 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C.

Typical Deposit Properties:

Coefficient of Static Friction 0.1
Coefficient of Dynamic Friction 0.08-0.10
PTFE Content 20-26%
Phosphorus Content 10-13% by wt.
Hardness:  
o as plated 300 VHN100
o heat treated @ 400°C for 1 hr. 550 VHN100
Salt Spray (ASTM-B-117) 1000+ hrs.
Stress compressive
Magnetic Properties non-magnetic
Deposition rate 0.25-0.35 mil per hour

Preferred Operating Conditions:

  Range Optimum
Solution Temperature 85°- 92 °C (185°-198°F) 88°C(190°F)
Solution pH 4.6 - 5.0 4.8
Bath Loading 0.3 - 1.0 ft2/gal 0.6 ft2/gal
Nickel Metal Concentration 0.65 - 0.85 oz/gal 0.8 oz/gal
H2PO2 Concentration 3.5 - 4.5 oz/gal 4.0 oz/gal
Agitation Light Mechanical  

Composite electroless nickel systems are covered under one or more of Surface Technology, Inc.'s US Patents numbered 4,997,686, 5,145,517, 5,300,330, 5,863,616, and others depending on materials and use.

CLICK HERE for additional information on the NiSLIP™ 510 Coatings

CLICK HERE for additional information on the NiSLIP™ 515 Coatings

CLICK HERE for additional information on the NiSLIP™ 520 Coatings

Consult a Surface Technology, Inc. Sales or Technical Service Representative for further information about this or any of our products and services.