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NiSLIP™ 500 The NiSLIP™ 500 composite PTFE - electroless nickel system is available in five systems. NiSLIP™ 510 uses a medium phosphorous alloy suitable for most applications, and NiSLIP™ 520 uses a high phosphorous alloy for applications requiring even greater corrosion resistance. A lead and cadmium free version of each of these systems is also available: NiSLIP™ 511 for medium phosphorous, and NiSLIP™ 521 for high phosphprous. All four systems utilize Surface Technology, Inc.'s patented NiSLIP™ 500 D PTFE Dispersion. The NiSLIP™ 515 system is notable for its revolutionary plating rate of two to three times conventional EN-PTFE plating baths. It is medium phosphorous and free of lead and cadmium. NiSLIP™ 510 A COMPOSITE PTFE, MEDIUM PHOSPHOROUS, ELECTROLESS NICKEL PLATING PROCESS The 510 system is a composite PTFE, mid-phosphorous, electroless nickel process designed to deposit a uniform composite with ultra-fine PTFE particles onto a great variety of metals, alloys, and non-conductors. The 510 system is available in two packaging options to best meet your needs. The NiPLATE™ option provides the greatest convenience to the user, while the ADDPLATE option provides the greatest economy for shipping and use. Both options produce the same properties and quality.
Some advantages of the 510 system are deposits with low coefficient of friction, self-lubricity, and excellent release properties; as well as corrosion resistance comparable to conventional electroless nickel. The 510 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C. Typical Deposit Properties:
Preferred Operating Conditions:
NiSLIP™ 515 A HIGH SPEED, COMPOSITE PTFE, MEDIUM PHOSPHOROUS, ELECTROLESS NICKEL PLATING PROCESS The 515 system is a composite PTFE, mid-phosphorous, electroless nickel process designed to deposit a uniform composite with ultra-fine PTFE at an exceptionally high plating rate. The 515 system features numerous important advantages for the plater:
The 515 system is available in two packaging options to best meet your needs. The NiPLATE™ option provides the greatest convenience to the user, while the ADDPLATE option provides the greatest economy for shipping and use. Both options produce the same properties and quality.
Some advantages of the 515 system are deposits with low coefficient of friction, self-lubricity, and excellent release properties; as well as corrosion resistance comparable to conventional electroless nickel. The 515 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C. Typical Deposit Properties:
Preferred Operating Conditions:
NiSLIP™ 520 A COMPOSITE PTFE, HIGH PHOSPHOROUS, ELECTROLESS NICKEL PLATING PROCESS The 520 system is a composite PTFE, high phosphorous, electroless nickel process designed to deposit a uniform composite with ultra-fine PTFE particles onto a great variety of metals, alloys, and non-conductors. The 520 system is available in two packaging options to best meet your needs. The NiPLATE™ option provides the greatest convenience to the user, while the ADDPLATE™ option provides the greatest economy for shipping and use. Both options produce the same properties and quality.
Some advantages of the 520 system are deposits with low friction, self-lubricity, and release properties; as well as increased corrosion resistance. The 520 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C. Typical Deposit Properties:
Preferred Operating Conditions:
Composite electroless nickel systems are covered under one or more of Surface Technology, Inc.'s US Patents numbered 4,997,686, 5,145,517, 5,300,330, 5,863,616, and others depending on materials and use. CLICK HERE for additional information on the NiSLIP™ 510 Coatings CLICK HERE for additional information on the NiSLIP™ 515 Coatings CLICK HERE for additional information on the NiSLIP™ 520 Coatings Consult a Surface Technology, Inc. Sales or Technical Service Representative for further information about this or any of our products and services.
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