ADDPLATE™ and NiPLATE™ 730

A COMPOSITE SILICON CARBIDE, LOW PHOSPHOROUS, ELECTROLESS NICKEL PLATING PROCESS

The 730 system is a composite silicon carbide, electroless nickel process designed to deposit a uniform composite with ultra-fine silicon carbide particles onto a great variety of metals, alloys, and non-conductors.  The 730 system is an alternative to the 700 system.  The two major advantages of the 730 system is that it plates at a faster rate and produces a deposit that is harder as plated, thereby reducing the need for a post plating heat treatment.

The 730 system is available in two packaging options to best meet your needs. The NiPLATE™ option provides the greatest convenience to the user, while the ADDPLATE™ option provides the greatest economy for shipping and use. Both options produce the same properties and quality.

  • The NiPLATE™ 730 option is supplied in four liquid concentrates: NiPLATE™ 730 A, 730 B, and 700 D are used for make-up, and NiPLATE™ 730 A, 730 C, and 700 D are used for replenishment.
  • The ADDPLATE™ 730 option is supplied in three liquid concentrates: ADDPLATE™ 730 M is used for bath make-up with NiPLATE™ 700 D and standard nickel sulfate and sodium hypophosphite commodities, and ADDPLATE™ 730 R is used for replenishment of the bath with NiPLATE™ 700 D and the same standard nickel sulfate and sodium hypophosphite commodities.

Some advantages of the 730 system are:

  • Deposits with exceptional wear resistance surpassing chrome plating
  • Higher hardness as plated of the low phosphorous nickel alloy
  • Corrosion resistance
  • High plating rate
  • Excellent stability and bath life
  • Ease of use comparable to conventional electroless nickel
  • Bath operation at lower temperatures

The 730 system electroless nickel processes meet or exceed MIL-C-26074D and AMS 2404C.

Typical Deposit Properties (for EN alloy devoid of particles):

Phosphorous Content

1-4% by wt.

Hardness:

 
  • as plated

700 VHN100
  • heat treated @ 400°C for 1 hr.

1000 VHN100

Salt Spray (ASTM-B-117)

100 hrs.

Stress

slightly compressive

Magnetic Properties

magnetic

Deposition rate

0.8 – 1.0 mil per hour

Preferred Operating Conditions:

 

Range

Optimum

Solution Temperature

70°- 85 °C (158°-185°F)

82°C(180°F)

Solution pH

5.7 - 6.6

6.1

Bath Loading

0.3 - 0.8 ft2/gal

0.5 ft2/gal

Nickel Metal Concentration

0.65 - 0.85 oz/gal

0.8 oz/gal

H2PO2 Concentration

3.5 - 4.5 oz/gal

4.0 oz/gal

Agitation

Mechanical and/or Filtered Air

 

Composite electroless nickel systems are covered under one or more of Surface Technology, Inc.'s US Patents numbered 4,997,686, 5,145,517, 5,300,330, 5,863,616, and others depending on materials and use.

Consult a Surface Technology, Inc. Sales or Technical Service Representative for further information about this or any of our products and services.