Electroless Nickel Plating Systems

The following chart depicts Surface Technology, Inc.’s electroless nickel and composite electroless nickel plating systems.  All are available as coating services applied in STI’s production facility or as chemical solutions for use in your plating facility. 

All chemical systems are formulated with the highest quality ingredients and quality control.  These chemicals are available in full proprietary NiPLATE™ (A, B, C, type) systems, or Addplate™ (M and R type) concentrates where the plater may use their own nickel sulfate and sodium hypophosphite commodities for additional economy and control.  For further information on Addplate™ concentrates or commodities available from STI, please click on these links.

For additional information on each of the plating bath systems, click on the system numbers below:

ELECTROLESS NICKEL

Medium Phosphorous

100   Fully bright
120   Bright, economical
121   Fully bright, lead and cadmium free
130   Bright, high speed
150   Matte finish, lead and cadmium free
181   Fully bright, lead and cadmium free, 1:1 replenishment

High Phosphorous

200   Maximum corrosion resistance
201   Maximum corrosion resistance, lead and cadmium free

Low Phosphorous

146   Pit-less technology for high thicknesses
300   High hardness as plated
301   High hardness as plated, lead and cadmium free

Nickel-Boron

Enbo™ 70   Nickel-boron alloy (0.5-1% boron)

Cobalt-Boron

Cobalt-Phosphorous

COMPOSITE ELECTROLESS NICKEL

Composite Diamond Coating®™

CDC-1™             1-micron diamond, extra smooth
CDC-2™             2-micron diamond, smooth
CDC-4™             4-micron diamond, smooth
CDC-8™             8-micron diamond, smooth, high density
CDC-20™           20-micron diamond, light texture
CDC-40™           40-micron diamond, textured

Nano-Plate™

Nano-Plate™ 250   Nano-meter diamond, ultra smooth
Nano-Plate™ 251   Lead and cadmium free version of Nano-Plate™ 250

Silicon Carbide

NiPLATE™ 700      Smooth, economical, hard, wear resistant
NiPLATE™ 730      Higher hardness as plated of the low phosphorous nickel alloy
NiPLATE™ 777      Textured, economical, hard

PTFE

NiSLIP™ 510        Medium phosphorous for most applications
NiSLIP™ 511        Medium phosphorous, lead and cadmium free
NiSLIP™ 515        High speed, medium phosphorous, lead and cadmium free
NiSLIP™ 520        High phosphorous for maximum corrosion resistance
NiSLIP™ 521        High phosphorous, lead and cadmium free

Boron Nitride

NiSLIP™ 25         Low friction, high hardness

Light Emitting

Illumi-layer™      Phosphorescent for authentication/indicating layers

Flame Retarding

NiPLATE™ 900      Flame and smoke retarding